Publishing Activity - 13113
Now showing items 1-20 of 60
-
Transient Effects on High Voltage Diode Stack under Reverse Bias
(2003)This article deals with a description and analysis of the fast transient processes which can occur during a local non-destructive breakdown in a circuit arranged by serial connection of reverse biased high-voltage silicon ... -
OCVD Carrier Lifetime in P+NN+ Diode Structures With Axial Carrier Lifetime Gradient
(2006)The OCVD (open circuit voltage decay) method is the generally used method for the determining of carrier lifetime in the structures of semiconductor devices. This paper is focused on power diode (PCNNC) structures, in ... -
Capacitive methodes for testing of power semiconductor devices
(2015)Electrical capacity of power semiconductor devices is quite an important parameter that can be utilized not only for testing a component itself, but it can also be applied practically; e.g. in series-connected high voltage ... -
An evaluation of the influence of a magnetic field on a human subject with the use of bio-impedance
(2010)The influence of a magnetic field on a living human organism was monitored using a bio-impedance evaluation of vasodilatation effects. A quantitative evaluation of the influence of a magnetic field on a human being was ... -
Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification
(2008)Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects ... -
Conditions of Temperature and Time Instability Occurrence of Reverse-Biased Semiconductor Power Devices
(2006)An investigation of the boundary states of power semiconductor devices is important with respect to their function reliability. Focus of this article is based on the evaluation of transient temperature increasing of ... -
Flux effect on void quantity and size in soldered joints
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
(2012)During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ... -
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ... -
Influence of Humidity on Voids Formation Inside the Solder Joint
(2013)Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ... -
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
(2016)Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ... -
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
(2014)Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ... -
Influence of latent heat released from solder joints on the reflow temperature profile
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ... -
Structure and properties of plasma sprayed BaTiO3 coatings
(Elsevier, 2010)Plasma spraying enables to create layers with thickness in a millimeter range adhering on various substrates. This paper provides a study of electric and mechanical properties of BaTiO3 coatings prepared by atmospheric ... -
Influence of chemical composition on dielectric properties of Al2O3 and ZrO2 plasma deposits
(2003)Aluminum oxide, zirconium oxide and their mixture were plasma sprayed by a water-stabilized plasma gun. Resulting deposits were studied as dielectrics. Capacity and loss factor were measured for the frequency range 200–106 ... -
Dielectric relaxation in calcium titanate-containing ceramics prepared by plasma spraying
(2003)The relative permittivity and loss factor frequency dependence in a weak electric field of plasma sprayed perovskite and ilminite polycrystalline ceramic materials—pure synthetic calcium titanate, as well as magnesium ... -
Phase stabilization in plasma sprayed BaTiO3
(2013)This paper presents a comparison of properties of BaTiO3 ceramics prepared by two different production methods: gas-stabilized plasma spraying (GSP) and spark plasma sintering (SPS). Samples of both materials were evaluated ... -
Dielectric properties of plasma sprayed titanates
(2001)This paper presents the study of the dielectric properties of three plasma-deposited titanates. The deposits were prepared from powders with the same starting composition as industrially produced dielectric ceramics. ... -
Comparison of Different Approaches of Manufacturing Process Optimization
(IEEE, 2010-09)There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ... -
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2010-05)Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ...
RSS 1.0