Prohlížení Publikační činnost - 13113 dle názvu
Zobrazují se záznamy 1-20 z 60
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Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
(IEEE, 2008-05)Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ... -
Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
(IEEE, 2007-05)This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ... -
Capacitive methodes for testing of power semiconductor devices
(2015)Electrical capacity of power semiconductor devices is quite an important parameter that can be utilized not only for testing a component itself, but it can also be applied practically; e.g. in series-connected high voltage ... -
Comparison of Different Approaches of Manufacturing Process Optimization
(IEEE, 2010-09)There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ... -
Conditions of Temperature and Time Instability Occurrence of Reverse-Biased Semiconductor Power Devices
(2006)An investigation of the boundary states of power semiconductor devices is important with respect to their function reliability. Focus of this article is based on the evaluation of transient temperature increasing of ... -
Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ... -
Design of Experiments of AlN Reactive Sputtering
(IEEE, 2009-05)Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ... -
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ... -
Diagnostics and Aging of Electrically Conductive Adhesives
(IEEE, 2000)Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ... -
Dielectric properties of plasma sprayed titanates
(2001)This paper presents the study of the dielectric properties of three plasma-deposited titanates. The deposits were prepared from powders with the same starting composition as industrially produced dielectric ceramics. ... -
Dielectric relaxation in calcium titanate-containing ceramics prepared by plasma spraying
(2003)The relative permittivity and loss factor frequency dependence in a weak electric field of plasma sprayed perovskite and ilminite polycrystalline ceramic materials—pure synthetic calcium titanate, as well as magnesium ... -
Electrical Connection Network Within an Electrically Conductive Adhesive
(IEEE, 2008-05)This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ... -
Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles
(IEEE, 2008-09)Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ... -
Electrically Loaded Adhesive Bonds Formed on Different Surfaces
(IEEE, 2007-05)Bonds of three types of electrically conductive adhesives with isotropic electrical conductivity have been formed on three types of surfaces - Cu; immerse Au and Sn (HAL). Epoxy resin types of adhesives with Ag flakes have ... -
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ... -
An evaluation of the influence of a magnetic field on a human subject with the use of bio-impedance
(2010)The influence of a magnetic field on a living human organism was monitored using a bio-impedance evaluation of vasodilatation effects. A quantitative evaluation of the influence of a magnetic field on a human being was ... -
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ... -
Flux effect on void quantity and size in soldered joints
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ...