Nedávno přidané

Zobrazují se záznamy 21-40 z 60

    • Comparison of Different Approaches of Manufacturing Process Optimization 

      Autor: Mach, Pavel; Barto, Seba
      (IEEE, 2010-09)
      There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ...
    • The Ontology based FMEA of Lead Free Soldering Process 

      Autor: Molhanec, Martin; Mach, Pavel; Mensah, David Asamoah Bamfo
      (IEEE, 2010-05)
      Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ...
    • Influence of Curing Process Parameters on Quality of Electrically Conductive Joints 

      Autor: Barto, Seba; Mach, Pavel
      (IEEE, 2010-05)
      Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ...
    • Thermomechanical Analysis of Electrically Conductive Adhesives 

      Autor: Mach, Pavel; Bušek, David; Polanský, Radek
      (IEEE, 2010-09)
      Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ...
    • Usability of Electrically Conductive Adhesives for Power Components Assembly 

      Autor: Mach, Pavel; Bušek, David; Ješ, Josef
      (IEEE, 2010-09)
      Sensitivity of the resistance of adhesive joints formed of frequently used electrically conductive adhesives with isotropic electrical conductivity (ICAs) to loading with short current pulses of high amplitude has been ...
    • Tolerance Design of Curing Process of Electrically Conductive Adhesives 

      Autor: Barto, Seba; Mach, Pavel
      (IEEE, 2010-05)
      The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints. The joints were ...
    • Design of Experiments of AlN Reactive Sputtering 

      Autor: Mach, Pavel; Kolářová, Jana
      (IEEE, 2009-05)
      Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ...
    • Thermal Ageing of Electrically Conductive Micro/Nano Adhesives 

      Autor: Mach, Pavel; Bušek, David
      (IEEE, 2010-09)
      Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints ...
    • Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive 

      Autor: Bušek, David; Pilarčíková, Ivana; Mach, Pavel
      (IEEE, 2010-05)
      Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced ...
    • Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives 

      Autor: Duraj, Aleš; Mach, Pavel
      (IEEE, 2008-05)
      Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ...
    • The Ontology based FMEA of Lead Free Soldering Process 

      Autor: Molhanec, Martin; Mach, Pavel
      (IEEE, 2009-05)
      Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ...
    • Influence of Carbon Nanotubes Added to a Commercial Adhesive 

      Autor: Bušek, David; Mach, Pavel
      (IEEE, 2009-05)
      This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ...
    • Preparation of Electrically Conductive Adhesives Modified with AgNO3 

      Autor: Neznámý autor
      (IEEE, 2009-05)
      The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler ...
    • Impedance of Adhesive Joints 

      Autor: Mach, Pavel; Kolář, Jiří
      (IEEE, 2009-09)
      Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ...
    • Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles 

      Autor: Mach, Pavel; Radev, Radoslav; Pietriková, Alena
      (IEEE, 2008-09)
      Electrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic ...
    • Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties 

      Autor: Mach, Pavel; Richter, Lukáš; Pietriková, Alena
      (IEEE, 2008-05)
      The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ...
    • Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints 

      Autor: Pietriková, A.; Mach, P.; Livovský, Ľ.; Urbančík, J.
      (IEEE, 2008-05)
      The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ...
    • Electrical Connection Network Within an Electrically Conductive Adhesive 

      Autor: Bušek, D.; Mach, P.
      (IEEE, 2008-05)
      This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ...
    • Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering 

      Autor: Mach, Pavel; Duraj, Aleš
      (IEEE, 2008-05)
      There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ...
    • Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives 

      Autor: Mach, Pavel; Richter, Lukáš; Pietriková, Alena
      (IEEE, 2008-09)
      The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ...