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Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints
(IEEE, 2007-05)
At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ...
Statistical Inspection of a Workplace for Adhesive Assembly
(IEEE, 2007-05)
Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ...
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)
Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ...
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)
Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ...
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)
Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...
Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)
This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ...
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)
Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ...
Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
(IEEE, 2008-05)
Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ...
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)
There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ...