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Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
(2012)
During soldering process intermetallic compounds
as a reaction between solder and substrate are
created. Physical properties of those compounds are different
to properties of solder and substrate. The influence ...
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)
Presented work shows the results of DSC measurement for six Sn based solders. The alloys
Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in
the temperature range from room temperature ...
Influence of Humidity on Voids Formation Inside the Solder Joint
(2013)
Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive
properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ...
Flux effect on void quantity and size in soldered joints
(2016)
This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce
their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ...
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
(2014)
Undercooling and recalescence were studied using the differential scanning
calorimetry (DSC) method on real electronic systems. Two solder pastes,
Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...