Now showing items 1-4 of 4
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ...
Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification
Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects ...
Conditions of Temperature and Time Instability Occurrence of Reverse-Biased Semiconductor Power Devices
An investigation of the boundary states of power semiconductor devices is important with respect to their function reliability. Focus of this article is based on the evaluation of transient temperature increasing of ...
Flux effect on void quantity and size in soldered joints
This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ...