Now showing items 1-4 of 4
Wetting Force Measurement of the Different Types of Solders and Testing Materials
We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ...
Solderability Measurement of Copper with Different Surface Finishes
This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ...
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ...
Influence of latent heat released from solder joints on the reflow temperature profile
The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ...