Procházení Publikační činnost - 13113 dle data publikování
Zobrazují se záznamy 1-20 z 60
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Diagnostics and Aging of Electrically Conductive Adhesives
(IEEE, 2000)Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ... -
Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy
(IEEE, 2001)Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, ... -
Dielectric properties of plasma sprayed titanates
(2001)This paper presents the study of the dielectric properties of three plasma-deposited titanates. The deposits were prepared from powders with the same starting composition as industrially produced dielectric ceramics. ... -
Influence of chemical composition on dielectric properties of Al2O3 and ZrO2 plasma deposits
(2003)Aluminum oxide, zirconium oxide and their mixture were plasma sprayed by a water-stabilized plasma gun. Resulting deposits were studied as dielectrics. Capacity and loss factor were measured for the frequency range 200–106 ... -
Dielectric relaxation in calcium titanate-containing ceramics prepared by plasma spraying
(2003)The relative permittivity and loss factor frequency dependence in a weak electric field of plasma sprayed perovskite and ilminite polycrystalline ceramic materials—pure synthetic calcium titanate, as well as magnesium ... -
Transient Effects on High Voltage Diode Stack under Reverse Bias
(2003)This article deals with a description and analysis of the fast transient processes which can occur during a local non-destructive breakdown in a circuit arranged by serial connection of reverse biased high-voltage silicon ... -
Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ... -
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Testing of Normality of Data Files for Application of SPC Tools
(IEEE, 2004-05)Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ... -
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ... -
Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
(IEEE, 2005)Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ... -
Processing of Alumina Nano-films
(IEEE, 2005-05)There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ... -
Conditions of Temperature and Time Instability Occurrence of Reverse-Biased Semiconductor Power Devices
(2006)An investigation of the boundary states of power semiconductor devices is important with respect to their function reliability. Focus of this article is based on the evaluation of transient temperature increasing of ... -
OCVD Carrier Lifetime in P+NN+ Diode Structures With Axial Carrier Lifetime Gradient
(2006)The OCVD (open circuit voltage decay) method is the generally used method for the determining of carrier lifetime in the structures of semiconductor devices. This paper is focused on power diode (PCNNC) structures, in ... -
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ... -
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ... -
Transformation of Data for Statistical Processing
(IEEE, 2006-05)The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ... -
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ... -
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...