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  • Publishing Activity - 13113
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  • Czech Technical University in Prague
  • Faculty of Electrical Engineering
  • Department of Electrotechnology
  • Publishing Activity - 13113
  • View Item
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Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis

Type of document
Preprint
Author
Dušek, Karel
Bušek, D.



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Abstract
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed though they would have worked normally. Since it is not possible to export such marked products, the total production quality decreases. In thiswork,we analyze the realmanufacturing problemusing Energy Dispersive Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis of potential source of residues together with its diagnostic and confirmation of its source is presented in this work.
URI
http://hdl.handle.net/10467/62802
Collections
  • Publikační činnost - 13113 [60]

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