Publikační činnost - 13113
Zobrazují se záznamy 41-60 z 60
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Can Conductive Adhesives With Nanoparticles Beat Commonly Used Electrically Conductive Adhesives Without Nanoparticles
(IEEE, 2007-05)This paper deals with electrically conductive adhesives (ECA's) with isotropic properties (ICA's) and describes the way of improving the quality parameters of such electrically conductive joint. This paper discusses the ... -
Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives
(IEEE, 2008-09)The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ... -
Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints
(IEEE, 2007-05)At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ... -
Statistical Inspection of a Workplace for Adhesive Assembly
(IEEE, 2007-05)Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ... -
Diagnostic Tools for Evaluation of the Quality of the Anisotropic Conductive Adhesive Joints
(IEEE, 2006-05)Isotropic and anisotropic electrically conductive adhesives (ICAs and AC As) are materials for special applications in electronic assembly. Quality of these adhesive joints is evaluated according of their electrical and ... -
Wetting Force Measurement of the Different Types of Solders and Testing Materials
(IEEE, 2007-05)We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ... -
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ... -
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ... -
Processing of Alumina Nano-films
(IEEE, 2005-05)There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ... -
Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
(IEEE, 2005)Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ... -
Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ... -
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ... -
Transformation of Data for Statistical Processing
(IEEE, 2006-05)The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ... -
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy
(IEEE, 2001)Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, ... -
Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ... -
Testing of Normality of Data Files for Application of SPC Tools
(IEEE, 2004-05)Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ... -
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ... -
Diagnostics and Aging of Electrically Conductive Adhesives
(IEEE, 2000)Resistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate ...