Modeling of Evaporation of Thin Films Using DOE
Typ dokumentupříspěvek z konference - elektronický
Práva© 2006 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
MetadataZobrazit celý záznam
Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the films have been created. A method of design of experiments has been used for design of the models. Three types of models have been designed and tested: a linear model, a combined one and a short combined one. First the models have been verified using an F-test. It has been found that a linear model is not satisfactory, therefore it has been rejected. Subsequently remaining two models have been verified by complementary experiments, when calculated values and values measured on newly fabricated films have been compared. It has been found an excellent conformity among calculated and measured values (plusmn 3%). Then the optimum fabrication conditions have been found by optimization of the models.
K tomuto záznamu jsou přiřazeny následující licenční soubory: