Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
Typ dokumentupříspěvek z konference - elektronický
Práva© 2005 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
MetadataZobrazit celý záznam
Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip components (resistors with "zero" values -jumpers) on printed-circuit boards with six different interconnection surface finishes: Cu (standard cleaning), oxidized Cu, Cu after degradation vapors of H2SO3, Ni, Au over Ni, Sn (HAL). The resistances, nonlinearity, and noise of joints have been investigated before and after application of the dynamic mechanical load, which has been realized by periodical deflection of the printed circuit boards with assembled resistive chips. The load of the individual joints has been calculated. It has been found that degradation of Cu surface does not cause significant changes of electrical properties of the joints. The worst electrical parameters as well as the lowest resistance against the dynamic mechanical load have been found for the joints realized on Ni and Sn surface finishes.
K tomuto záznamu jsou přiřazeny následující licenční soubory: