Prohlížení Publikační činnost - 13113 dle názvu
Zobrazují se záznamy 17-36 z 60
-
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ... -
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ... -
Flux effect on void quantity and size in soldered joints
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ... -
Impedance of Adhesive Joints
(IEEE, 2009-09)Impedance of adhesive joints has been measured in frequency range 20 Hz - 1 MHz using LCR meter HP 4284A. The joints have been created by adhesive assembly of jumpers on test PCBs. It has been found that the joint impedance ... -
Influence of Carbon Nanotubes Added to a Commercial Adhesive
(IEEE, 2009-05)This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ... -
Influence of chemical composition on dielectric properties of Al2O3 and ZrO2 plasma deposits
(2003)Aluminum oxide, zirconium oxide and their mixture were plasma sprayed by a water-stabilized plasma gun. Resulting deposits were studied as dielectrics. Capacity and loss factor were measured for the frequency range 200–106 ... -
Influence of Curing Process Parameters on Quality of Electrically Conductive Joints
(IEEE, 2010-05)Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ... -
Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ... -
Influence of Humidity on Voids Formation Inside the Solder Joint
(2013)Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ... -
Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
(IEEE, 2005)Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ... -
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
(2012)During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ... -
Influence of latent heat released from solder joints on the reflow temperature profile
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ... -
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ... -
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ... -
Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints
(IEEE, 2007-05)At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ... -
Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints
(IEEE, 2008-05)The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ... -
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ... -
Modification of Adhesive Joints Resistance with Current Pulses
(IEEE, 2010-05)Strips of electrically conductive adhesive were printed on a test PCB. Strips were processed by a standard curing process and then aged at the temperature of 125 oC. One group of samples was aged in an oven; the second ... -
Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties
(IEEE, 2008-05)The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ...