Prohlížení Publikační činnost - 13113 dle názvu
Zobrazují se záznamy 48-60 z 60
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Testing of Normality of Data Files for Application of SPC Tools
(IEEE, 2004-05)Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ... -
Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives
(IEEE, 2008-09)The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ... -
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2010-05)Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ... -
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2009-05)Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ... -
Thermal Ageing of Electrically Conductive Micro/Nano Adhesives
(IEEE, 2010-09)Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints ... -
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
(IEEE, 2010-05)Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced ... -
Thermomechanical Analysis of Electrically Conductive Adhesives
(IEEE, 2010-09)Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ... -
Tolerance Design of Curing Process of Electrically Conductive Adhesives
(IEEE, 2010-05)The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints. The joints were ... -
Transformation of Data for Statistical Processing
(IEEE, 2006-05)The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ... -
Transient Effects on High Voltage Diode Stack under Reverse Bias
(2003)This article deals with a description and analysis of the fast transient processes which can occur during a local non-destructive breakdown in a circuit arranged by serial connection of reverse biased high-voltage silicon ... -
Usability of Electrically Conductive Adhesives for Power Components Assembly
(IEEE, 2010-09)Sensitivity of the resistance of adhesive joints formed of frequently used electrically conductive adhesives with isotropic electrical conductivity (ICAs) to loading with short current pulses of high amplitude has been ... -
Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy
(IEEE, 2001)Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, ... -
Wetting Force Measurement of the Different Types of Solders and Testing Materials
(IEEE, 2007-05)We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ...