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Influence of High Current Load on Electrical Properties of Adhesive Conductive Joints
(IEEE, 2006-09)
Isotropic and anisotropic electrically conductive adhesives (ICAs and ACAs) are alternative materials for substitution of common used tin-lead solders in electronic assembly. Electrically conductive adhesives are potential ...
Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)
This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ...
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)
Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ...
Transformation of Data for Statistical Processing
(IEEE, 2006-05)
The use of many statistical tools depends on normality of processed data. There are different methods for transformation of non-normally distributed data sets toward to normally distributed ones. The goal of the work has ...
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)
Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ...
Modification of Adhesive Joints Resistance with Current Pulses
(IEEE, 2010-05)
Strips of electrically conductive adhesive were printed on a test PCB. Strips were processed by a standard curing process and then aged at the temperature of 125 oC. One group of samples was aged in an oven; the second ...
Thermomechanical Analysis of Electrically Conductive Adhesives
(IEEE, 2010-09)
Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ...
Usability of Electrically Conductive Adhesives for Power Components Assembly
(IEEE, 2010-09)
Sensitivity of the resistance of adhesive joints formed of frequently used electrically conductive adhesives with isotropic electrical conductivity (ICAs) to loading with short current pulses of high amplitude has been ...
Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
(IEEE, 2008-05)
Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ...
Tolerance Design of Curing Process of Electrically Conductive Adhesives
(IEEE, 2010-05)
The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints. The joints were ...