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The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2010-05)
Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ...
Influence of Curing Process Parameters on Quality of Electrically Conductive Joints
(IEEE, 2010-05)
Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ...
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
(IEEE, 2010-05)
Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced ...
Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives
(IEEE, 2008-09)
The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ...
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)
Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ...
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)
Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ...
Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy
(IEEE, 2001)
Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, ...
Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)
Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ...
Testing of Normality of Data Files for Application of SPC Tools
(IEEE, 2004-05)
Different types of statistical tests have been used for evaluation of the normality of selected data files. The files have been simulated to be on the border of normality. The results of the tests have been compared. It ...
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)
Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ...