Hledat
Zobrazují se záznamy 31-35 z 35
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2009-05)
Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ...
Influence of Carbon Nanotubes Added to a Commercial Adhesive
(IEEE, 2009-05)
This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ...
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)
There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ...
Solderability Measurement of Copper with Different Surface Finishes
(IEEE, 2010-05)
This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ...
Wetting Force Measurement of the Different Types of Solders and Testing Materials
(IEEE, 2007-05)
We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ...