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Design of Experiments of AlN Reactive Sputtering
(IEEE, 2009-05)
Reactive sputtering has been used for fabrication of AlN films. The process has been investigated in two levels of power of a generator, in two levels of the working pressure and in two levels of the working gas flow. The ...
Comparison of Different Approaches of Manufacturing Process Optimization
(IEEE, 2010-09)
There are many process variables, which more or less influence quality of a manufacturing process, and there are many parameters of a product, which constitute its quality. The control of variables of a manufacturing process ...
Thermal Ageing of Electrically Conductive Micro/Nano Adhesives
(IEEE, 2010-09)
Electrical as well as mechanical properties of electrically conductive adhesives can be modified by addition of different types of nanoparticles. It has been investigated if changes of the resistance of adhesive joints ...
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2010-05)
Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, ...
Influence of Curing Process Parameters on Quality of Electrically Conductive Joints
(IEEE, 2010-05)
Curing parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more ...
Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive
(IEEE, 2010-05)
Mechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced ...
Testing of Techniques for Improvement of Conductivity of Electrically Conductive Adhesives
(IEEE, 2008-09)
The paper presents methods, which have been used for improvement of electrical conductivity of electrically conductive adhesives with isotropical electrical conductivity. Conductivity level depends, among other things, on ...
Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)
Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ...
Fabrication of AI203 and AIN thin films by reactive sputtering and its optimization using DOE
(IEEE, 2004-05)
Thin films of Al2O3 and AlN have been fabricated by reactive sputtering using magnetron sputtering equipment. A mixture of Ar and O2 has been used for the fabrication of Al2O3 films, and a mixture of Ar and N2 has been ...
Utilization of the Seven Ishikawa Tools (Old Tools) in the Six Sigma Strategy
(IEEE, 2001)
Statistical process control (SPC) has become one of the most important applications of statistics in the electronics industry. It covers a variety of tools, and it can be considered that the seven Ishikawa (“old”) tools, ...