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Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)
Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ...
Modification of Adhesive Joints Resistance with Current Pulses
(IEEE, 2010-05)
Strips of electrically conductive adhesive were printed on a test PCB. Strips were processed by a standard curing process and then aged at the temperature of 125 oC. One group of samples was aged in an oven; the second ...
Thermomechanical Analysis of Electrically Conductive Adhesives
(IEEE, 2010-09)
Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ...
Usability of Electrically Conductive Adhesives for Power Components Assembly
(IEEE, 2010-09)
Sensitivity of the resistance of adhesive joints formed of frequently used electrically conductive adhesives with isotropic electrical conductivity (ICAs) to loading with short current pulses of high amplitude has been ...
Analysis and Prediction of Electrical Contact Resistance for Anisotropic Conductive Adhesives
(IEEE, 2008-05)
Anisotropic conductive adhesives (ACAs) and anisotropic conductive films (ACFs) are promising solder alternatives. These materials are preferable for fine pitch and ultra-fine pitch connections in electronics assembly. ...
Tolerance Design of Curing Process of Electrically Conductive Adhesives
(IEEE, 2010-05)
The work was directed at examination of influence of tolerances of curing process parameters on the tolerances of the resistance and nonlinearity of a current vs. voltage characteristic of adhesive joints. The joints were ...
The Ontology based FMEA of Lead Free Soldering Process
(IEEE, 2009-05)
Paper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the area of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools suitable for our intention ...
Influence of Carbon Nanotubes Added to a Commercial Adhesive
(IEEE, 2009-05)
This paper describes the influence of carbon nanotubes onto electrical properties of electrically conductive adhesives. This work is related to our previous research that described electrical connection network within ...
Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering
(IEEE, 2008-05)
There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule ...
Preparation of Electrically Conductive Adhesives Modified with AgNO3
(IEEE, 2009-05)
The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler ...