Prohlížení Publikační činnost - 13113 dle autora "Bušek, D."
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Electrical Connection Network Within an Electrically Conductive Adhesive
Autor: Bušek, D.; Mach, P.
(IEEE, 2008-05)This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and ... -
Flux effect on void quantity and size in soldered joints
Autor: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Influence of Interconnection Surface Finishes on Quality of Adhesive Joints
Autor: Mach, P.; Bušek, D.; Duraj, A.
(IEEE, 2005)Electrically conductive adhesives electrically connect and mechanically bond circuits to a variety of substrates. Four different silver-filled isotropically conductive adhesives have been used for attaching of 1206 chip ... -
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Autor: Dušek, Karel; Bušek, D.
(2016)Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ...