Prohlížení Publikační činnost - 13113 dle názvu
Zobrazují se záznamy 28-47 z 60
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Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
(2012)During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ... -
Influence of latent heat released from solder joints on the reflow temperature profile
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ... -
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ... -
Influence of trimming of resistive thick films on nonlinearity of their current vs. voltage characteristics
(IEEE, 2004-05)Investigation of changes of nonlinearity of thick resistive films, trimmed by laser and by grinding, has been carried out. Laser trimming has been realized by an Ar laser, mechanical trimming by grinding of the layer by a ... -
Measurement of Nonlinearity as a Diagnostic Tool for Quality Determination of Lead-Free Solder Joints
(IEEE, 2007-05)At present there are directions RoHS-WEEE in European Union which restrict the use of certain hazardous substances in new electric and electronic products. Therefore mass usage of lead-free soldering in electronic production ... -
Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints
(IEEE, 2008-05)The goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation ... -
Modeling of Evaporation of Thin Films Using DOE
(IEEE, 2006-05)Evaporation of thin films is widely spread technology. The goal of the work has been to optimize a process of fabrication of thin resistive Ni films. Mathematical models for calculation of thickness and resistance of the ... -
Modification of Adhesive Joints Resistance with Current Pulses
(IEEE, 2010-05)Strips of electrically conductive adhesive were printed on a test PCB. Strips were processed by a standard curing process and then aged at the temperature of 125 oC. One group of samples was aged in an oven; the second ... -
Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties
(IEEE, 2008-05)The goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of ... -
OCVD Carrier Lifetime in P+NN+ Diode Structures With Axial Carrier Lifetime Gradient
(2006)The OCVD (open circuit voltage decay) method is the generally used method for the determining of carrier lifetime in the structures of semiconductor devices. This paper is focused on power diode (PCNNC) structures, in ... -
Phase stabilization in plasma sprayed BaTiO3
(2013)This paper presents a comparison of properties of BaTiO3 ceramics prepared by two different production methods: gas-stabilized plasma spraying (GSP) and spark plasma sintering (SPS). Samples of both materials were evaluated ... -
Preparation of Electrically Conductive Adhesives Modified with AgNO3
(IEEE, 2009-05)The goal of the work has been to find if addition of Ag+ ions into electrically conductive adhesive can improve its electrical conductivity. Ag+ ions can aggregate and form additional conductive bridges between filler ... -
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
(2016)Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ... -
Processing of Alumina Nano-films
(IEEE, 2005-05)There are different technologies for processing of alumina thin films. It has been found that only some of them are usable for reliable and reproducible processing of nano-films with the thickness of 2 through 3 nm. Such ... -
Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification
(2008)Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual standard tests do not reveal total information concerning the technological genetic aspects ... -
Solderability Measurement of Copper with Different Surface Finishes
(IEEE, 2010-05)This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ... -
Stability of Electrical Resistance of Isotropic Conductive Adhesives within Mechanical Stress
(IEEE, 2006-09)This work is focused on investigation of influence of dynamic mechanical load (bending of testing boards) on resistance of the adhesive joints. The load has been induced by a definite deflection of testing boards (fiberglass ... -
Statistical Inspection of a Workplace for Adhesive Assembly
(IEEE, 2007-05)Quality of a workplace for adhesive assembly has been examined using acceptance sampling. The goal of the work has been to find our whether dispensing of electrically conductive adhesive makes forming of adhesive joints ... -
Structure and properties of plasma sprayed BaTiO3 coatings
(Elsevier, 2010)Plasma spraying enables to create layers with thickness in a millimeter range adhering on various substrates. This paper provides a study of electric and mechanical properties of BaTiO3 coatings prepared by atmospheric ... -
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
(2014)Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...