Now showing items 1-2 of 2

    • Flux effect on void quantity and size in soldered joints 

      Author: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
      (2016)
      This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ...
    • Influence of Humidity on Voids Formation Inside the Solder Joint 

      Author: Dušek, K.; Vlach, J.; Brejcha, M.; Hájková, L.; Žák, P.
      (2013)
      Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ...