Prohlížení Publikační činnost - 13113 dle autora "Plaček, M."
-
Flux effect on void quantity and size in soldered joints
Autor: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Influence of latent heat released from solder joints on the reflow temperature profile
Autor: Dušek, Karel; Rudajevová, A.; Plaček, M.
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ...