Prohlížení Publikační činnost - 13113 dle autora "Dušek, Karel"
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Influence of latent heat released from solder joints on the reflow temperature profile
Autor: Dušek, Karel; Rudajevová, A.; Plaček, M.
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ... -
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
Autor: Dušek, Karel; Bušek, D.
(2016)Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads. These residues may have non-conductive character and therefore in-circuit test may mark tested product as failed ... -
Solderability Measurement of Copper with Different Surface Finishes
Autor: Dušek, Karel; Novák, Michal; Mach, Pavel
(IEEE, 2010-05)This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ... -
Wetting Force Measurement of the Different Types of Solders and Testing Materials
Autor: Dušek, Karel; Urbánek, Jan; Mach, Pavel; Drápala, Jaromír
(IEEE, 2007-05)We have used one of the most commonly used wetability evaluation methods -wetting balance (meniscograph) method to measure the wetting force. We have made a modification of the measuring equipment to measure a less quantity ...