Prohlížení Publikační činnost - 13113 dle autora "Dušek, K."
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Flux effect on void quantity and size in soldered joints
Autor: Bušek, D.; Dušek, K.; Růžička, D.; Plaček, M.; Mach, P.; Urbánek, J.; Starý, J.
(2016)This article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes ... -
Influence of Humidity on Voids Formation Inside the Solder Joint
Autor: Dušek, K.; Vlach, J.; Brejcha, M.; Hájková, L.; Žák, P.
(2013)Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on ... -
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Autor: Podzemský, J.; Papež, V.; Urbánek, J.; Dušek, K.
(2012)During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ... -
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
Autor: Rudajevová, A.; Dušek, K.
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ... -
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
Autor: Rudajevová, A.; Dušek, K.
(2014)Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...