Show simple item record

dc.contributor.authorBušek, D.
dc.contributor.authorDušek, K.
dc.contributor.authorRůžička, D.
dc.contributor.authorPlaček, M.
dc.contributor.authorMach, P.
dc.contributor.authorUrbánek, J.
dc.contributor.authorStarý, J.
dc.date.accessioned2016-03-18T08:51:15Z
dc.date.available2016-03-18T08:51:15Z
dc.date.issued2016
dc.identifier.citationD. Bušek, et al., Flux effect on void quantity and size in soldered joints, Microelectronics Reliability (2016), http://cze
dc.identifier.issn0026-2714
dc.identifier.urihttp://hdl.handle.net/10467/62845
dc.description.abstractThis article is focused on both macro and microvoids in soldered joints and the use of additional flux to reduce their frequency and minimize their negative effect on the soldered joint reliability. In total five fluxes were used, three were gel based (NC559, MTV-125R, TSF-6516) and two of them were liquid based (Topnik G-5, JBC FL-15). They were used within two solder pastes, both lead and lead-free. The reflow process was identical for all of the combinations and was within the range of manufacturer recommended profiles. The amount of voids was evaluated using X-ray analysis. It was found that the use of increased amount of proper flux, specifically flux with higher activity, in the solder paste may significantly lower the void occurrencecze
dc.language.isoencze
dc.subjectAssembly manufacturingcze
dc.subjectReliabilitycze
dc.subjectSolderingcze
dc.subjectVoidscze
dc.subjectFluxcze
dc.titleFlux effect on void quantity and size in soldered jointscze
dc.typeArticlecze


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record