Dušek, K. - Bušek, D.: Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis. Microelectronics Reliability. 2016, vol. 56, no. 1, p. 162-169. ISSN 0026-2714.
Surface Mount Technology (SMT) assembly often faces the issue of residues on In Circuit Testing (ICT) pads.
These residues may have non-conductive character and therefore in-circuit test may mark tested product as
failed though they would have worked normally. Since it is not possible to export such marked products, the
total production quality decreases. In thiswork,we analyze the realmanufacturing problemusing Energy Dispersive
Spectroscopy (EDS) analysis of the stains with the aim to find the possible source of residues that appear on
the testing pads during the mass electronic assembly or during Printed Circuit Board (PCB) production. Analysis
of potential source of residues together with its diagnostic and confirmation of its source is presented in this
work.
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dc.language.iso
en
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dc.subject
Assembly manufacturing
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dc.subject
Flux spattering
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dc.subject
In-circuit test
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dc.subject
Reliability
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dc.subject
Scanning electron microscopy
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dc.subject
Soldering
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dc.title
Problem with no-clean flux spattering on in-circuit testing pads diagnosed by EDS analysis
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dc.type
Preprint
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