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dc.contributor.authorBarto, Seba
dc.contributor.authorMach, Pavel
dc.date.accessioned2012-08-06T10:13:48Z
dc.date.available2012-08-06T10:13:48Z
dc.date.issued2010-05
dc.identifier.citationBarto, S. - Mach, P. Influence of Curing Process Parameters on Quality of Electrically Conductive Joints. In: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010, p. 147-150. ISBN 978-1-4244-7849-1.cze
dc.identifier.urihttp://hdl.handle.net/10467/12424
dc.description.abstractCuring parameters of electrically conductive adhesives are the temperature and the time. These parameters are recommended by a manufacturer of adhesive. The goal of the work is to find which of these parameters is more important for achievement of the low electrical resistance and low nonlinearity of a current vs. voltage characteristic of an adhesive joint. A method of factorial experiments of the type 22 and Taguchi orthogonal array of the type L4 were used for this study. It was found that the joint resistance is mostly influenced by the curing time, less by the curing temperature and the lowest influence has the interaction of the time/temperature. Nonlinearity is also influenced mostly by the curing time and less by the curing temperature and by the interaction time/temperature.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleInfluence of Curing Process Parameters on Quality of Electrically Conductive Jointscze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2010.5547278


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