Přestup tepla při chlazení elektronické součástky

Abstract

The contents of this work are aimed at the impact of thermal paste parameters on heat transfer during the cooling process for electrical devices. It was suggested to use both water and air matters in two straightforward cooling system situations. The two designed cooling systems are first analysed by calculations of 1D problems to cool down the electrical device (CPU) below 60°C. CFD simulations are then carried out using 3D geometry to compare what different effects it has. Various suggestions for the ideal heat transfer coefficient that correlate with the flow rate of both water and air, along with the ideal thermal conductivity and the thickness of the thermal paste layer were investigated.

The contents of this work are aimed at the impact of thermal paste parameters on heat transfer during the cooling process for electrical devices. It was suggested to use both water and air matters in two straightforward cooling system situations. The two designed cooling systems are first analysed by calculations of 1D problems to cool down the electrical device (CPU) below 60°C. CFD simulations are then carried out using 3D geometry to compare what different effects it has. Various suggestions for the ideal heat transfer coefficient that correlate with the flow rate of both water and air, along with the ideal thermal conductivity and the thickness of the thermal paste layer were investigated.