Přestup tepla při chlazení elektronické součástky
Heat transfer of electronic device cooling
Typ dokumentu
bakalářská prácebachelor thesis
Autor
Giang Truong Nguyen
Vedoucí práce
Skočilas Jan
Oponent práce
Štancl Jaromír
Studijní obor
Energetika a procesní technikaStudijní program
StrojírenstvíInstituce přidělující hodnost
ústav procesní a zpracovatelské technikyObhájeno
2023-02-13Práva
A university thesis is a work protected by the Copyright Act. Extracts, copies and transcripts of the thesis are allowed for personal use only and at one?s own expense. The use of thesis should be in compliance with the Copyright Act http://www.mkcr.cz/assets/autorske-pravo/01-3982006.pdf and the citation ethics http://knihovny.cvut.cz/vychova/vskp.htmlVysokoškolská závěrečná práce je dílo chráněné autorským zákonem. Je možné pořizovat z něj na své náklady a pro svoji osobní potřebu výpisy, opisy a rozmnoženiny. Jeho využití musí být v souladu s autorským zákonem http://www.mkcr.cz/assets/autorske-pravo/01-3982006.pdf a citační etikou http://knihovny.cvut.cz/vychova/vskp.html
Metadata
Zobrazit celý záznamAbstrakt
The contents of this work are aimed at the impact of thermal paste parameters on heat transfer during the cooling process for electrical devices. It was suggested to use both water and air matters in two straightforward cooling system situations. The two designed cooling systems are first analysed by calculations of 1D problems to cool down the electrical device (CPU) below 60°C. CFD simulations are then carried out using 3D geometry to compare what different effects it has. Various suggestions for the ideal heat transfer coefficient that correlate with the flow rate of both water and air, along with the ideal thermal conductivity and the thickness of the thermal paste layer were investigated. The contents of this work are aimed at the impact of thermal paste parameters on heat transfer during the cooling process for electrical devices. It was suggested to use both water and air matters in two straightforward cooling system situations. The two designed cooling systems are first analysed by calculations of 1D problems to cool down the electrical device (CPU) below 60°C. CFD simulations are then carried out using 3D geometry to compare what different effects it has. Various suggestions for the ideal heat transfer coefficient that correlate with the flow rate of both water and air, along with the ideal thermal conductivity and the thickness of the thermal paste layer were investigated.
Kolekce
- Bakalářské práce - 12118 [142]