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dc.contributor.authorMach, P.
dc.contributor.authorŠkvor, M.
dc.contributor.authorSzáraz, P.
dc.date.accessioned2012-07-02T13:20:43Z
dc.date.available2012-07-02T13:20:43Z
dc.date.issued2000
dc.identifier.citationMach, P. - Škvor, M. - Száraz, P. Diagnostics and Aging of Electrically Conductive Adhesives. In: 22nd International Conference on Microelectronics. Niš: IEEE Electron Devices Society, 2000, vol. 1, p. 517-520. ISBN 0-7803-5235-1.cze
dc.identifier.urihttp://hdl.handle.net/10467/9581
dc.description.abstractResistance and nonlinearity of the current vs. voltage characteristics (NAVC) of adhesive joints was investigated. The joints were prepared of four types of electrically conductive adhesives (ECA) on Cu clad FR4 laminate and on Cu clad FR4 laminate with gold coating on the Cu. The circuit layer was designed to make 4-point measurements possible. Adhesives were applied by dispensing. The boards were assembled by resistors of the value 0 Ω recommended for assembly using adhesives. The samples were aged at the temperature of 200°C and 160°C, respectively, for different time. Significant changes of resistance and NAVC were found during aging of adhesives. It was found that NAVC is a parameter, which is very sensitive to changes of ECA and therefore could be very useful for diagnostics of these materials.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2000 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleDiagnostics and Aging of Electrically Conductive Adhesivescze
dc.typepříspěvek z konference - tištěnýcze
dc.identifier.doi10.1109/ICMEL.2000.838744


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