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Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)
Presented work shows the results of DSC measurement for six Sn based solders. The alloys
Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in
the temperature range from room temperature ...