Hledat
Zobrazují se záznamy 1-3 z 3
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)
Presented work shows the results of DSC measurement for six Sn based solders. The alloys
Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in
the temperature range from room temperature ...
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
(2014)
Undercooling and recalescence were studied using the differential scanning
calorimetry (DSC) method on real electronic systems. Two solder pastes,
Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...
Influence of latent heat released from solder joints on the reflow temperature profile
(2016)
The reflow process of SAC305 solder paste was
investigated by differential scanning calorimetry (DSC) and
measurement of the temperature profiles in a real continual
convection reflow furnace. Melting and solidification ...