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Frequency Dependence of Impedance of Adhesive Joints
(IEEE, 2006-09)
Electrically conductive adhesives have, in comparison with solders, significantly higher non-homogeneity of the structure, and therefore stability of electrical as well as mechanical properties of adhesive joints is lower ...
Degradation of Adhesive Bonds with Short Current Pulses
(IEEE, 2003-05)
Degradation of adhesive bonds powered by rectangular very short current pulses of the width of 1 μs and frequency of 1 kHz of high amplitude has been examined. The amplitudes of the pulses have been 5 and 10 A. Power ...
Equipment for measurement of nonlinearity of nominally linear components
(IEEE, 2006-05)
Nonlinearity of a nominally linear component is a significant parameter, which informs about the difference of and investigated component from an ideal one. The higher is quality of the nominally linear component; the lower ...
Reliability of Reverse Properties of Power Semiconductor Devices: Influence of Surface Dielectric Layer and its Experimental Verification
(2008)
Reliability of reverse properties of power semiconductor devices is an important condition for their practical application. Usual
standard tests do not reveal total information concerning the technological genetic aspects ...