Browsing Publikační činnost - 13113 by Subject "undercooling solidification"
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Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ...