Prohlížení Publikační činnost - 13113 dle autora "Rudajevová, A."
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Influence of latent heat released from solder joints on the reflow temperature profile
Autor: Dušek, Karel; Rudajevová, A.; Plaček, M.
(2016)The reflow process of SAC305 solder paste was investigated by differential scanning calorimetry (DSC) and measurement of the temperature profiles in a real continual convection reflow furnace. Melting and solidification ... -
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
Autor: Rudajevová, A.; Dušek, K.
(2012)Presented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature ... -
Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints
Autor: Rudajevová, A.; Dušek, K.
(2014)Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5, were used for preparation of ...