• Thermomechanical Analysis of Electrically Conductive Adhesives 

      Autor: Mach, Pavel; Bušek, David; Polanský, Radek
      (IEEE, 2010-09)
      Mechanical properties of isotropic electrically conductive adhesives (ICAs) are mainly influenced by their formulation and thermal processing. Thermomechanical analysis of ICAs was used with the goal to find influence of ...