Prohlížení Publikační činnost - 13113 dle autora "Podzemský, J."
-
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
Autor: Podzemský, J.; Papež, V.; Urbánek, J.; Dušek, K.
(2012)During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence ...