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    • Solderability Measurement of Copper with Different Surface Finishes 

      Author: Dušek, Karel; Novák, Michal; Mach, Pavel
      (IEEE, 2010-05)
      This article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders ...