Rudajevová, A. - Dušek, K.: Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders. Kovové materiály. 2012, vol. 50, no. 5, p. 295-300. ISSN 0023-432X.
Presented work shows the results of DSC measurement for six Sn based solders. The alloys
Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in
the temperature range from room temperature up to 400◦C. The transformation temperatures
for melting as well as for solidification were influenced by the composition and thermal history
of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature
and the heating/cooling rate. It is shown that the rate of solidification is far larger
than that of the melting. The solidification rate is not influenced by neither the composition
nor the thermal history of the material. Analysis of these results is presented.
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dc.language.iso
en
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dc.subject
Sn alloys
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dc.subject
phase transformations
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dc.subject
undercooling solidification
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dc.subject
DSC
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dc.title
Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders
