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dc.contributor.authorRudajevová, A.
dc.contributor.authorDušek, K.
dc.date.accessioned2016-03-11T12:50:16Z
dc.date.available2016-03-11T12:50:16Z
dc.date.issued2012
dc.identifier.citationRudajevová, A. - Dušek, K.: Influence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solders. Kovové materiály. 2012, vol. 50, no. 5, p. 295-300. ISSN 0023-432X.cze
dc.identifier.urihttp://hdl.handle.net/10467/62807
dc.description.abstractPresented work shows the results of DSC measurement for six Sn based solders. The alloys Sn96Ag4, Sn99Cu1, Sn97Cu3, Sn96.5Ag3Cu0.5, Sn95.5Ag3.8Cu0.7 and Sn63Pb37 were studied in the temperature range from room temperature up to 400◦C. The transformation temperatures for melting as well as for solidification were influenced by the composition and thermal history of the alloys. The thermal history was altered by changing the maximum thermal cycle temperature and the heating/cooling rate. It is shown that the rate of solidification is far larger than that of the melting. The solidification rate is not influenced by neither the composition nor the thermal history of the material. Analysis of these results is presented.cze
dc.language.isoencze
dc.subjectSn alloyscze
dc.subjectphase transformationscze
dc.subjectundercooling solidificationcze
dc.subjectDSCcze
dc.titleInfluence of the thermal history and composition on the melting/solidification process in Sn-Ag-Cu solderscze


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