Dušek, K. - Vlach, J. - Brejcha, M. - Hájková, L. - Žák, P. - et al.: Influence of Humidity on Voids Formation Inside the Solder Joint. Advanced Science, Engineering and Medicine. vol. 5, no. 6, p. 543-547. ISSN 2164-6627.
Void is defined such as blow hole in the solder joint. Voids may degrade the mechanical and conductive
properties of the solder joint and thus decrease the reliability. Article deals with influence of humidity on voids
formation inside the solder joint structure. Experimental part was carried on testing samples, where we used
three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow
technology (hot air, vapor phase and infra radiation reflow technology) and three types of humidity environments.
The inspection was made on X-ray and following diagnostic was made by image analysis with special software.
We evaluate the number of voids together with their total area of all voids inside solder joints. Results indicate
that the number of voids together with their total area mainly depends on type of used solder paste. Dependence
of used reflow process on voids formation is minor and the influence of components humidity on voids formation
wasn’t observed.
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dc.language.iso
en
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dc.subject
Solder Joint
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dc.subject
Humidity
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dc.subject
Voids
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dc.title
Influence of Humidity on Voids Formation Inside the Solder Joint