Dušek, K. - Rudajevová, A. - Plaček, M.: Influence of latent heat released from solder joints on the reflow temperature profile. Journal of materials science - materials in electronics. 2016, vol. 27, no. 1, p. 543-549. ISSN 0957-4522.
The reflow process of SAC305 solder paste was
investigated by differential scanning calorimetry (DSC) and
measurement of the temperature profiles in a real continual
convection reflow furnace. Melting and solidification processes
of two solder joints were investigated by bothmethods
to determine the influence of latent heat on the surrounding
temperature. While one peak was present during melting in
DSC, two peaks were present during solidification of two
joints connected by a resistor. The released latent heat from
one joint increased the temperature of the surroundings and
delayed the solidification process of the second joint.Analysis
of the temperature profiles obtained during the reflow processes
in a real furnace shows that latent heat influences the
surrounding temperature not only during the phase transformation,
but also during the whole following passage of the
sample in the furnace. The maximum temperature increase of
the joint is substantial: 25 mg of the solder paste increases the
joint temperature by about 15 C. When two joints are placed
on the sample the temperature increase is close to 20 C.
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Influence of latent heat released from solder joints on the reflow temperature profile
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