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dc.contributor.authorDušek, Karel
dc.contributor.authorNovák, Michal
dc.contributor.authorMach, Pavel
dc.date.accessioned2012-08-06T09:38:49Z
dc.date.available2012-08-06T09:38:49Z
dc.date.issued2010-05
dc.identifier.citationDušek, K. - Novák, M. - Mach, P. Solderability Measurement of Copper with Different Surface Finishes. In: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010, p. 113-116. ISBN 978-1-4244-7849-1.cze
dc.identifier.urihttp://hdl.handle.net/10467/12422
dc.description.abstractThis article deals with solders wettability measurement of materials with different surface finishes, which are commonly used as solder pads on printed circuit board. The measurement was carried out on two type of solders (Sn63Pb37, Sn95,5Ag3,8Cu0,7), two types of fluxes (94-RXZ-M (IPC-ANCI-J-STD-004 - REL0), 323-ITV (C-ANCI-J-STD-004 - REL1)) and as testing material we used one-side plating PCB (FR4) with four types of surface finishes (pasivated copper, H.A.L, immersion tin, chemical gold plating). For the measurement we have used one of the commonly used wettability evaluation methods - wetting balance (meniscograph) method. Wetting balance method measures the wetting force when the test specimen is immersed into the molten solder bath. Wetting force is measured as a function of time and recorded as wetting curve. We marked the wettability, according to the shape of wetting curve, for each testing combination and sorted them into the table.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleSolderability Measurement of Copper with Different Surface Finishescze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2010.5547267


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