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dc.contributor.authorMolhanec, Martin
dc.contributor.authorMach, Pavel
dc.contributor.authorMensah, David Asamoah Bamfo
dc.date.accessioned2012-08-06T09:33:33Z
dc.date.available2012-08-06T09:33:33Z
dc.date.issued2010-05
dc.identifier.citationMolhanec, M. - Mach, P. - Mensah, D. A. B. The Ontology based FMEA of Lead Free Soldering Process. In: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010, p. 360-364. ISBN 978-1-4244-7849-1.cze
dc.identifier.urihttp://hdl.handle.net/10467/12421
dc.description.abstractPaper is directed to improvement of a FMEA (Failure Mode and Effects Analysis) procedure in the field of reflow lead free soldering by the use of an ontology paradigm. Some ontology editor tools, suitable for our intention, are presented. Particular phases of ontology utilization for development of more exact approach to the FMEA procedure of reflow lead free soldering are analyzed. A proposal of a user's guide for the FMEA procedure based on an ontology paradigm is presented. This user's guide is included in university courses Management of Production Quality and Complex Quality Control provided by the Department of Electro-Technology.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleThe Ontology based FMEA of Lead Free Soldering Processcze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2010.5547322


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