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dc.contributor.authorBušek, David
dc.contributor.authorPilarčíková, Ivana
dc.contributor.authorMach, Pavel
dc.date.accessioned2012-08-03T09:10:34Z
dc.date.available2012-08-03T09:10:34Z
dc.date.issued2010-05
dc.identifier.citationBušek, D. - Pilarčíková, I. - Mach, P. Thermomechanical Analysis of a Bulk of Electrically Conductive Adhesive. In: 33rd International Spring Seminar on Electronics Technology. New York: IEEE, 2010, p. 10-13. ISBN 978-1-4244-7849-1.cze
dc.identifier.urihttp://hdl.handle.net/10467/12417
dc.description.abstractMechanical properties of isotropically conductive adhesives depend not just on the internal structure and composition (amount and type of binder and filler) of the adhesive, but also on chemical processes that are influenced by curing. Thermomechanical analysis allows to distinguish the point when the adhesive is fully cured, it may reveal a difference in mechanical properties after different modifications of the adhesive, it may give a clue to better thermal processing of the adhesive while curing. Thermal analysis of totally nine types of adhesive modifications was performed, particularly the influence of carbon nanotubes addition, silver nanoparticles and colloidal silver was observed. In our tests, both one-component and two-component adhesives were used. The overview of tested adhesives and their modifications is described in table 1.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2010 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleThermomechanical Analysis of a Bulk of Electrically Conductive Adhesivecze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2010.5547250


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