Bušek, D. - Mach, P. Electrical Connection Network Within an Electrically Conductive Adhesive. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, p. 184-188. ISBN 978-1-4244-3973-7.
This paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and differences between failures within soldered joints and electrically conductive adhesive joints. This article compares theoretical models with real measurement and properties of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.
