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dc.contributor.authorBušek, D.
dc.contributor.authorMach, P.
dc.date.accessioned2012-08-01T12:57:48Z
dc.date.available2012-08-01T12:57:48Z
dc.date.issued2008-05
dc.identifier.citationBušek, D. - Mach, P. Electrical Connection Network Within an Electrically Conductive Adhesive. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, p. 184-188. ISBN 978-1-4244-3973-7.cze
dc.identifier.urihttp://hdl.handle.net/10467/12407
dc.description.abstractThis paper deals with the connection network in isotropically conductive adhesives (ICAs). The reader will learn about conductive network creation, tunneling effect, possible ways of modeling the conductive network and differences between failures within soldered joints and electrically conductive adhesive joints. This article compares theoretical models with real measurement and properties of the electrically conductive adhesive. The inner structure of the adhesive that is either formed by micro-sized particles, or micro-sized particles mixed with nano-sized particles, is described.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleElectrical Connection Network Within an Electrically Conductive Adhesivecze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2008.5276536


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