Show simple item record



dc.contributor.authorMach, Pavel
dc.contributor.authorRadev, Radoslav
dc.contributor.authorPietriková, Alena
dc.date.accessioned2012-08-01T12:49:31Z
dc.date.available2012-08-01T12:49:31Z
dc.date.issued2008-09
dc.identifier.citationMach, P. - Radev, R. - Pietriková, A. Electrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticles. In: ESTC 2008. Greenwich, London: University of Greenwich, 2008, p. 1141-1146. ISBN 978-1-4244-2813-7.cze
dc.identifier.urihttp://hdl.handle.net/10467/12406
dc.description.abstractElectrically conductive adhesive with isotropical electrical conductivity modified with addition of silver nanoparticles has been investigated. The electrical resistance, nonlinearity of a current vs. voltage characteristic and the tensile strength of adhesive joints formed of this adhesive have been measured. The specimens have also been aged at the temperature of 125degC and at the combined climate 80degC/80 % relative humidity for 700 hours. It has been found that silver nanoparticles added into the electrically conductive adhesive cause decrease of its conductivity, increase of its nonlinearity and increase of the tensile strength.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleElectrically Conductive Adhesive Filled with Mixture of Silver Nano and Microparticlescze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ESTC.2008.4684513


Files in this item



This item appears in the following Collection(s)

Show simple item record