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dc.contributor.authorMach, Pavel
dc.contributor.authorDuraj, Aleš
dc.date.accessioned2012-08-01T12:41:53Z
dc.date.available2012-08-01T12:41:53Z
dc.date.issued2008-05
dc.identifier.citationMach, P. - Duraj, A. Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, vol. 1, p. 400-404. ISBN 978-1-4244-3973-7.cze
dc.identifier.urihttp://hdl.handle.net/10467/12405
dc.description.abstractThere are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule of FMEA has been set. Then a flow chart of a process has been drawn and critical failures including their consequences for the final product have been described. Criteria for significance of failures characterization have been defined and have been used for evaluation of significance of failures. Diagnostic methods for critical failures have been proposed and corrective actions have been realized.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleFailure Mode and Effects Analysis of a Process of Reflow Lead-Free Solderingcze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2008.5276636


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