Mach, P. - Duraj, A. Failure Mode and Effects Analysis of a Process of Reflow Lead-Free Soldering. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, vol. 1, p. 400-404. ISBN 978-1-4244-3973-7.
There are many methods usable for production process optimization. The paper describes the use of failure mode and effects analysis (FMEA of a process type) for the process of lead-free soldering improvement. The schedule of FMEA has been set. Then a flow chart of a process has been drawn and critical failures including their consequences for the final product have been described. Criteria for significance of failures characterization have been defined and have been used for evaluation of significance of failures. Diagnostic methods for critical failures have been proposed and corrective actions have been realized.
