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dc.contributor.authorPietriková, A.
dc.contributor.authorMach, P.
dc.contributor.authorLivovský, Ľ.
dc.contributor.authorUrbančík, J.
dc.date.accessioned2012-08-01T12:34:59Z
dc.date.available2012-08-01T12:34:59Z
dc.date.issued2008-05
dc.identifier.citationPietriková, A. - Mach, P. - Ďurišin, J. - Livovský, L. - Urbančík, J. Microstructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Joints. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, p. 365-368. ISBN 978-1-4244-3973-7.cze
dc.identifier.urihttp://hdl.handle.net/10467/12404
dc.description.abstractThe goal of the study is to compare quality of lead-free vapour phase reflowed solder joints soldered on different printed circuit board (PCB) surface finishes. The solder joints quality comparison is based on evaluation of microstructure development of the solder, solder/PCB pad interface and on the measurement of the solder joints nonlinearity of the current-voltage (C-V) characteristics. The microstructure is evaluated before and after accelerated ageing.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleMicrostructure Analysis and Measurement of Nonlinearity of Vapour Phase Reflowed Solder Jointscze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2008.5276669


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