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dc.contributor.authorMach, Pavel
dc.contributor.authorRichter, Lukáš
dc.contributor.authorPietriková, Alena
dc.date.accessioned2012-08-01T12:28:32Z
dc.date.available2012-08-01T12:28:32Z
dc.date.issued2008-05
dc.identifier.citationMach, P. - Richter, L. - Pietriková, A. Modification of Electrically Conductive Adhesives for Better Mechanical and Electrical Properties. In: 31st International Spring Seminar on Electronics Technology [CD-ROM]. New York: IEEE, 2008, vol. 1, p. 230-235. ISBN 978-1-4244-3973-7.cze
dc.identifier.urihttp://hdl.handle.net/10467/12403
dc.description.abstractThe goal of the work has been to check a possibility of improvement of electrical properties of electrically conductive adhesives with isotropic electrical conductivity to edge these properties toward to properties of solders. The electrical resistance and nonlinearity of I-V characteristic have been investigated. Two ways have been used for electrically conductive adhesive modification: addition of small amount of silver nanoparticles (grains) of three different dimensions into adhesive, and substitution of a part of filler flakes with the same amount of nanoparticles. It has been found that addition of silver nanoparticles increases the resistance and nonlinearity of adhesive. It has also been found that adhesives modified with nanoparticles have lower sensitivity to combined climatic ageing in comparison with adhesives without nanoparticles. The reason is other quality of contacts between flakes and contacts between nanoparticles.eng
dc.language.isocescze
dc.publisherIEEEcze
dc.rights© 2008 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.eng
dc.titleModification of Electrically Conductive Adhesives for Better Mechanical and Electrical Propertiescze
dc.typepříspěvek z konference - elektronickýcze
dc.identifier.doi10.1109/ISSE.2008.5276560


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